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MPC8535EBVTATH 数据表(PDF) 111 Page - Freescale Semiconductor, Inc

部件名 MPC8535EBVTATH
功能描述  PowerQUICC??III Integrated Processor Hardware Specifications
PDF  126 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MPC8535EBVTATH 数据表(HTML) 111 Page - Freescale Semiconductor, Inc

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Thermal
MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
111
Figure 72. System Level Thermal Model for MPC8535E (Not to Scale)
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part
in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the
part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat
sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to
determine the optimal grid for their specific case.
2.24.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
Substrate
Die
Bump/underfill
A
A
Section A-A
Solder/air
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