MPC8535EBVTATH datasheet(124/126 Pages) FREESCALE

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MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2

Mechanical Dimensions of the MPC8535E FC-PBGA

Freescale Semiconductor

124

Product Documentation

The following documents are required for a complete description of the device and are needed to design properly with the part.

•

MPC8536E Integrated Processor Reference Manual

(document number: MPC8536ERM)

•

e500 PowerPC Core Reference Manual

(document number: E500CORERM)

Document Revision History

Table 85 provides a revision history for the MPC8535E hardware specification.

Table 85. Document Revision History

Revision

Date

Substantive Change(s)

09/2009

• In Section 1, “Pin Assignments and Reset States,”updated the first sentence of the note to say, “The

UART_SOUT[0:1] and TEST_SEL pins must be set to a proper state during POR configuration.”

•In Table 40, “SGMII DC Receiver Electrical Characteristics,” changed LSTSAB to LSTSA and

LSTSEF to LSTSE for Note 4.

•In Table 80, “MPC8535E Thermal Model,” updated die value and bump/underfill value.

• Updated Figure 81, “Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8535E

FC-PBGA,” and its notes.

09/2009

• In Table 3, “Recommended Operating Conditions,” for VDD_CORE, removed 1.1 ± 55 mV.

•In Table 5, “MPC8535E Power Dissipation 5,” remove note 5.

•In Table 5, ”MPC8535E Power Dissipation 5,” changed an “—”’ to “0.”

08/2009

• Initial public release.

MPC8535EBVTATH 数据表(PDF) 124 Page - Freescale Semiconductor, Inc