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LSRFSBK2093-R1-PF 数据表(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LSRFSBK2093-R1-PF 数据表(HTML) 7 Page - LIGITEK electronics co., ltd. |
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7 / 7 page ![]() LSRFSBK2093/R1-PF PART NO. Page 6/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reliability Test: Test Item Operating Life Test High Temperature Storage Test Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Thermal Shock Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test |
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