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LSRFSGM3362-R1 数据表(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LSRFSGM3362-R1 数据表(HTML) 7 Page - LIGITEK electronics co., ltd. |
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7 / 7 page ![]() MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Solderability Test Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Reliability Test: Thermal Shock Test High Temperature High Humidity Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Item Test Condition This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Description Reference Standard Page 6/6 LSRFSGM3362/R1 PART NO. |
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