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LSRFVG2363-R1-PF 数据表(PDF) 7 Page - LIGITEK electronics co., ltd.

部件名 LSRFVG2363-R1-PF
功能描述  LSRFVG2363-R1-PF
PDF  7 Pages
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制造商  LIGITEK [LIGITEK electronics co., ltd.]
网页  http://www.ligitek.com
标志 LIGITEK - LIGITEK electronics co., ltd.

LSRFVG2363-R1-PF 数据表(HTML) 7 Page - LIGITEK electronics co., ltd.

  LSRFVG2363-R1-PF Datasheet HTML 1Page - LIGITEK electronics co., ltd. LSRFVG2363-R1-PF Datasheet HTML 2Page - LIGITEK electronics co., ltd. LSRFVG2363-R1-PF Datasheet HTML 3Page - LIGITEK electronics co., ltd. LSRFVG2363-R1-PF Datasheet HTML 4Page - LIGITEK electronics co., ltd. LSRFVG2363-R1-PF Datasheet HTML 5Page - LIGITEK electronics co., ltd. LSRFVG2363-R1-PF Datasheet HTML 6Page - LIGITEK electronics co., ltd. LSRFVG2363-R1-PF Datasheet HTML 7Page - LIGITEK electronics co., ltd.  
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Reference
Standard
MIL-STD-883:1008
JIS C 7021: B-10
JIS C 7021: B-12
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Test Item
Operating Life Test
Test Condition
Reliability Test:
High Temperature
Storage Test
1.Ta=105
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
Low Temperature
Storage Test
1.Ta=-40
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Description
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
Solder Resistance
Test
1.T.Sol=260
℃±5℃
2.Dwell time= 10
±1sec.
1.Ta=105
℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
Solderability Test
1.T.Sol=230
℃±5℃
2.Dwell time=5
±1sec
This test intended to see soldering well
performed or not.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202:103B
JIS C 7021: B-11
High Temperature
High Humidity Test
1.Ta=65
℃±5℃
2.RH=90 %~95%
3.t=240hrs
±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
PART NO. LSRFVG2363/R1-PF



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