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LSRFVG42292-R1-PF 数据表(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LSRFVG42292-R1-PF 数据表(HTML) 7 Page - LIGITEK electronics co., ltd. |
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7 / 7 page ![]() MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Solder Resistance Test Solderability Test Thermal Shock Test Low Temperature Storage Test High Temperature High Humidity Test High Temperature Storage Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test: Test Item PART NO. Test Condition Description Reference Standard Page 6/6 LSRFVG42292/R1-PF |
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