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ST7689 数据表(PDF) 10 Page - Sitronix Technology Co., Ltd. |
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ST7689 数据表(HTML) 10 Page - Sitronix Technology Co., Ltd. |
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10 / 195 page ![]() ST7689 Version 1.0 Page 10 of 195 2009/10 3. PAD ARRANGEMENT (COG) Chip Size : 11434 um x 701 um Bump Pitch : PAD1~19, 156~174, 175~235 pitch= 22um(min, com/seg) PAD 236 ~ 619, 620~ 680 pitch= 22um(min, com/seg) PAD 235 ~ 236, 619~620 pitch=116.33um (min, com/seg) PAD 21~27,32~48, 50~51, 52~56, 58~59, 60~154 pitch= 80um(I/O) PAD 27~29, 48~49, 56~57 pitch= 60um(I/O) PAD 29~30, 31~32, 51~52, 59~60 pitch= 100um(I/O) PAD 30~31 pitch= 120um(I/O) PAD 49~50, 57~58 pitch= 40um(I/O) Bump Size : PAD30~31, 51, 59 Bump width=105um (min, I/O) Bump space=15um (min, I/O) Bump length=63um(min, I/O) Bump area=6615um^2(I/O) PAD28, 49~50, 57~58 Bump width=25um (min, I/O) Bump space=15um (min, I/O) Bump length=63um(min, I/O) Bump area=1575um^2(I/O) PAD21~27, 29, 32~48, 52~56, 60~154 Bump width=65um (min, I/O) Bump space=15um (min, I/O) Bump length=63um(min, I/O) Bump area=4095um^2(I/O) PAD1~19, 156~174, 175~235, 236~619, 620~680 Bump width=10.5um (min, com/seg) Bump space=11.5um (min, com/seg) Bump length=149.4um(min, com/seg) Bump area=1568.7um^2(com/seg) ST7689-G4 (Bump Height: 15um, Hardness: 75HV) ST7689-G4-1 (Bump Height: 12um, Hardness: 90HV) Chip Thickness: 300um Alignment mark The center of alignment mark: see bellow Table |
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