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PROD.

NAME

ABC'S DWG NO.

ABC'S ITEM NO.

Ⅰ﹒CONFIGURATION & DIMENSIONS：

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅴ﹒GENERAL SPECIFICATION：

c﹒Solderability：Preheat 150℃. 60 sec

a﹒Storage temp.：-55℃---- +125℃

b﹒Operating temp.：-55℃ ---- +125℃

Solder：H63A

Solder temp.：230±5℃

Flux：Rosin

Dip time：4±1 sec

MH2012□□□□L□-□□□

A

:

2.00±0.20

m/m

B

:

1.20±0.20

C

:

0.85±0.20

D

:

0.50±0.30

m/m

m/m

m/m

Ⅲ﹒FEATURES：

a﹒Monolithic structure ensuring high performance and reliability.

b﹒High frequency applications up to 6GHz.

a﹒RF modules for telecommunication systems including

Ⅳ﹒APPLICATIONS：

GSM, PCS,DECT,WLAN,Bluetooth,etc.

A

D

200

50

0

50

100

150

200

Time ( seconds )

100

150

250

70sec max.

Peak Temp：260℃ max.

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

Temperature

250

+4.0

/ sec max.

℃

Rising Area

Forced Cooling Area

50sec max.

-(1.0 ~ 5.0)

/ sec max.

℃

150 ~ 200

/ 60 ~ 120sec

℃

Preheat Area

+2.0 ~ 4.0℃

/ sec max.

Reflow Area

Peak Temperature:

230

℃

260

℃

c﹒Terminal：Ag/Cu/Ni/Sn

d﹒Remark：Products comply with RoHS' requirements

MULTILAYER CHIP INDUCTOR

AR-001A