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SW2022R82K2 数据表(PDF) 7 Page - ABC Taiwan Electronics Corp

部件名 SW2022R82K2
功能描述  WOUND CHIP INDUCTOR
PDF  8 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  ABC [ABC Taiwan Electronics Corp]
网页  http://www.atec-group.com
标志 ABC - ABC Taiwan Electronics Corp

SW2022R82K2 数据表(HTML) 7 Page - ABC Taiwan Electronics Corp

  SW2022R82K2 Datasheet HTML 1Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 2Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 3Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 4Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 5Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 6Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 7Page - ABC Taiwan Electronics Corp SW2022R82K2 Datasheet HTML 8Page - ABC Taiwan Electronics Corp  
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Temp.:50±2℃
Humidity test
appearance.
Note: Inductors are to be tested after 1 hour at room temperature.
R.H.:90~95 %
Time.:96±2 hours
+125
for 30 minutes.
-40
for 30 minutes.
Time.:48±2 hours
Temp.:125±2℃
Time.:48±2 hours
Total:10 cycles
Temp.:-40±2℃
1.Temp:85±2℃
1.Temp:40±2℃
2.R.H.:90-95%
2.Time:1000±12 hours
3.Time:1000±12 hours
4. Load:Allowed DC current
3.Load:Allowed DC current
AR-001A
Humidity load life
High temperature
storage
load life
High tempera - ture
test
storage
Thermal shock test
Low temperature
shorted or open winding.
Inductors shall not have a
3.Q shall not change
2.Inductance shall not change
more than±10%
more than ±5%
ABC'S DWG NO.
ABC'S ITEM NO.
attachment.
SPECIFICATION FOR APPROVAL
force indicated at left without a failure
device must withstand the minimum
the side of the component . The
copper substrate. A dynometer
force gauge shall be applied to
(230±5
for 10 seconds) to a tinned
The device shall be reflow soldered
of the termination to board
-40 ~125
℃℃
PROD.
WOUND CHIP INDUCTOR
Temperature
characteristic
NAME
adhesion
(Push test)
Component
deformation or change in
1.There shall be no case
20N:2012,2520,3225
10N:1608
5N:1005
REF :
SW2022□□□□2□-□□□
PAGE: 7



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