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ABC'S DWG NO.

ABC'S ITEM NO.

attachment.

PROD.

NAME

adhesion

(Push test)

Component

WOUND CHIP INDUCTOR

10N：1608

20N：2012，2520，3225

SPECIFICATION FOR APPROVAL

force indicated at left without a failure

device must withstand the minimum

the side of the component . The

copper substrate. A dynometer

force gauge shall be applied to

(230±5

for 10 seconds) to a tinned

℃

The device shall be reflow soldered

of the termination to board

-55

~125

℃℃

Temp.：50±2℃

R.H.：90~95 %

Time.：96±2 hours

+125

for 30 minutes.

℃

-40

for 30 minutes.

℃

Time.：48±2 hours

Temp.：125±2℃

Time.：48±2 hours

Total：10 cycles

Temp.：-40±2℃

Temperature

Humidity test

characteristic

storage

storage

Thermal shock test

High temperature

Low temperature

Note： Inductors are to be tested after 1 hour at room temperature.

appearance.

3.Q shall not change

more than ±5%

2.Inductance shall not change

more than±10%

deformation or change in

1.There shall be no case

1.Temp：85±2℃

1.Temp：40±2℃

2.R.H.：90-95%

test

life

load life

High tempera - ture

Humidity load

AR-001A

shorted or open winding.

Inductors shall not have a

2.Time：1000±12 hours

3.Time：1000±12 hours

4. Load：Allowed DC current

3.Load：Allowed DC current

SW1005□□□□L□-□□□

5N：1005

REF : 20080711-B