50

For

SD Memory

Card

For

microSD™

Card

For

SIM Card

8pins

For

W-SIM

For

Memory

Stick Micro™

Combine Type

For

Express

Card™

For

Compact

Flash™

For PC cards

supporting

CardBus

For CMOS

Camera Module

For

Memory

Stick™

Soldering Conditions

Example of Reflow Soldering Condition

（Reference）

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）.

3. Temperature profile

（Surface of products）.

200

100

240

℃(max.)

230

℃(min.)

150

℃

180

℃

Time (s)

10 sec.(max.)

90

±30 sec.

Room

temperature

Pre-heating

Heating time

sec.

1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or

electrical degradation to occur depending on the conditions. Caution is therefore required.

2. Avoid use of water-soluble soldering flux, since it may corrode the product.

3. Check and conform to reflow soldering requirements under actual mass production conditions.

4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and

layout.

5. The card specifications are provided by the above manufactures. Products by other manufactures may not be

compliant with these specifications and are subject to change without prior notice.

Cautions for using this product

Small Memory Card Connectors