Snap-in

Type

Surface

Mount Type

Radial

Type

TACT Switch

TM

Sharp

Feeling

Soft

Feeling

306

Detector

Push

Slide

Rotary

Encoders

Power

Dual-in-line

Package Type

Custom-

Products

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）at solder joints（copper foil surface）. A heat resistive tape

should be used to fix thermocouple.

3. Temperature profile

Soldering Conditions

Condition for Reflow

Available for Surface Mount Type.

180

150

260˚C max. 3 sec max.

230˚C

Time

120 sec max.（pre-heating ）

3 to 4min.

Time inside soldering equipment

Temperature (˚C )

40s max.

Manual Soldering

（Except SKRT Series）

Flux built-up

Mounting surface

should not be exposed to fluk

Ambient temperature of the soldered

surface of PC board.

100

℃ max.

60s max.

260

℃ max.

5s max.

Preheating temperature

Preheating time

Soldering temperature

Duration of immersion

Items

Condition

Condition

2times max.

Number of soldering

Soldering temperature

350

℃max.

3s max.

Duration of soldering

60W max.

Capacity of soldering iron

Items

1. Consult with us for availability of TACT Switch

2. Prevent flux penetration from the top side of the TACT Switch

3. Switch terminals and a PC board should not be coated with flux prior to soldering.

4. The second soldering should be done after the switch is stable with normal temperature.

5. Use the flux with a specific gravity of min 0.81.

（EC-19S-8 by TAMURA Corporation, or equivalents.）

Notes

Conditions for Auto-dip

Available for Snap-in Type and Radial Type

（Except SKHJ, SKHL, SKQJ, SKQK, SKEG series）

1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC

board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards

and others. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Note