Variable

Resistor Type

Switch

Type

492

Multi Control

Devices

F

（s）

Example of Reflow Soldering Condition

1. Heating method:

Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）at solder joints copper foil surface）. A heat resistive tape

should be used to fix thermocouple.

3. Temperature profile

300

200

100

A max.

B

E

D

Time (s)

C

Room

temperature

Pre-heating

F max.

Series

（Reflow type）

240

230

150

120

SLLB, SLLB5

20

150

260

SKRV/SKRH/SKQUBA,DB/SSAF/SRBE

40

180

260

40

RKJXS

A

（℃）

3s max.

B

（℃）

C

（s）

D

（℃）

E

（℃）

1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC

board's temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards

and others. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Notes

Soldering Conditions

Switch Type Multi Control Devices