172

Rotary

Encoders

Power

Dual-in-line

Package Type

Detector

Push

Slide

Custom-

Products

TACT Switch

TM

Rotary Switches

Soldering Conditions

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）at soldering portion（copper foil surface）.A heat resisting tape

should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

C

Time (s)

20 max.

E max.

Pre-heating

D max.

F

Room

temperature

Series

（Reflow type）

SRBQ

240

230

―

―

150

120

A

（℃）

3s max.

B

（℃）

C

（℃）

D

（s）

E

（s）

F

（s）

300

200

100

A max.

B

D

E

C

Time (s)

F max.

Room

temperature

Pre-heating

Series

（Reflow type）

SRBD

260

230

150

120

40

180

A

（℃）

3s max.

B

（℃）

C

（s）

D

（℃）

E

（℃）

F

（s）

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where

the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,

thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Notes