Power

79

Detector

Push

Slide

Rotary

Encoders

Dual-in-line

Package Type

TACT Switch

TM

Custom-

Products

Detector Switches

Soldering Conditions

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）at soldering portion（copper foil surface）.A heat resisting tape

should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

E

D

Time (s)

C

Pre-heating

F max.

Room

temperature

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where

the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,

thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Notes

Series

（Reflow type）

SPPB

260

230

200

230

40

20

40

180

150

120

SPVN

SPPW8

SPVP

SPVE

SPVG

SPVL

250

SPVM

SPVS

SSCM

SPPY5

240

20

150

Room

temperature

180

SPVR

A

（℃）

3s max.

B

（℃）

C

（s）

D

（℃）

E

（℃）

F

（s）