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AS1115

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Input Voltage Range

-0.3

7

V

All other pins to GND

-0.3

7 or

V

Current

DIG0:DIG7 Sink Current

500

mA

SEGA:SEGG, SEGDP

100

mA

Humidity

5

85

%

Non-condensing

Electrostatic Discharge

Digital outputs

1000

V

Norm: MIL 833 E method 3015

All other pins

1000

V

Latch-Up Immunity

±100

mA

EIA/JESD78

Thermal Resistance

88

ºC/W

on PCB, QSOP-24 package

30.5

ºC/W

on PCB, TQFN(4x4)-24 package

Ambient Temperature

-40

+85

ºC

Storage Temperature

-55

150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering

temperature (body temperature)

specified is in accordance with IPC/

JEDEC J-STD-020D “Moisture/

Reflow Sensitivity Classification for

Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).