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AS1322 数据表(PDF) 13 Page - ams AG |
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AS1322 数据表(HTML) 13 Page - ams AG |
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13 / 17 page ![]() www.austriamicrosystems.com Revision 1.07 13 - 17 AS1322 Data Sheet - Ap p lica tio n In fo r m a tio n PCB Layout Guidelines The high-speed operation of the AS1322 requires proper layout for optimum performance. Figure 21 shows the recom- mended component layout. ! A large ground pin copper area will help to lower the device temperature. ! A multi-layer board with a separate ground plane is recommended. ! Traces carrying large currents should be direct. ! Trace area at pin FB should be as small as is practical. ! The lead-length to the battery should be as short as is practical. Figure 21. Recommended Single-Layer Component Placement 1 AS1322 2 3 6 5 4 Optional SHDNN VIN FB VOUT GND SW VOUT VIN SHDNN R2 R1 COUT CIN |
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