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AS1331

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

SW1, SW2, VIN, VOUT, EN

-0.3

+7

V

PGND to GND

-0.3

+0.3

V

SW1, SW2

-0.3

+7

V

ESD

4

kV

HBM MIL-Std. 883E 3015.7 methods

Thermal Resistance

+33

ºC/W

Junction Temperature

+150

ºC

Operating Temperature Range

-40

85

ºC

Storage Temperature Range

-65

+125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

020D “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).