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AS1335

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VIN to GND

-0.3

6

V

SW to GND

-0.3

V

EN, FB to GND

-0.3

V

P-Channel Switch Source Current (DC)

1.5

A

N-Channel Switch Source Current (DC)

1.5

A

Peak SW Sink and Source Current

3

A

Thermal Resistance

36.7

ºC/W

on PCB

Latch-Up

-100

100

mA

@85°C, JEDEC 78

Electrostatic Discharge

2kV

HBM MIL-Std. 883E 3015.7 methods

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Junction Temperature

125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages

is matte tin (100% Sn).