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AS1339

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

IN1A, IN1B, IN2 to AGND

-0.3

+7

V

PAA, PAB, PA_EN, TEST, REFIN,

NC to AGND

-0.3

0.3

V

LDO1, LDO2, EN1, EN2 to AGND

-0.3

0.3

V

IN2 to IN1B/IN1A

-0.3

+0.3

V

PGND to AGND

-0.3

+0.3

V

LX Current

0.7

Bypass Current

1.6

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

ESD Rating

Human Body Model

1kV

HBM MIL-Std. 883E 3015.7

methods

Operating Ratings

REFIN Common-Mode Range

0

V

Recommended Load Current

650

mA

Continuous Power Dissipation

0.75

W

-40

+125

ºC

-40

+85

ºC

In applications where high power dissipation

and/or poor package thermal resistance is

present, the maximum ambient temperature

may have to be derated.

dependent on the maximum operating junction

power dissipation

junction-to ambient thermal resistance of the

part/package in the application (

the following