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AS1355

Preliminary Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-

tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

ENx, VDDx to GND

-0.3

7

V

VOUTx to GND

-0.3

5

V

Any other pin to GND

-0.3

V

Thermal Resistance

33

ºC/W

on PCB

Package-Body Peak

Temperature

260

°C

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for non-hermetic

Solid State Surface Mount Devices”.

Operating Temperature

-40

85

°C

Storage Temperature

-65

150

°C

Electrostatic Discharge

Protection (ESD) Level

2

kV

HBM – Norm: MIL 883 E method 3015.