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Revision 1.47

3 - 20

AS1702 - AS1705

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

†

Using PCB metal plane and thermally-conductive paste.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Unit

Comments

-0.3

+7

V

Any Other Pin to GND

-0.3

V

Input Current (Latchup Immunity)

-50

50

mA

JEDEC 17

Continuous Power Dissipation

†

600

mW

MSOP-10

Continuous Power Dissipation

†

1,000

mW

MSOP-10

Electro-Static Discharge (ESD)

1

kV

Human Body Model and MIL-Std883E

3015.7 methods

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-020C

“Moisture/Reflow Sensitivity Classification

for Non-Hermetic Solid State Surface Mount

Devices”