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AS1741

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

†

Signals on pins COM1, COM2, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes.

Limit forward-diode current to the maximum current rating.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

V+, INx to GND

-0.3

+5

V

COMx, NOx, NCx to GND

†

-0.3

V+

+ 0.3

V

COMx, NOx, NCx Continuous Current

-250

+250

mA

COMx, NOx, NCx Peak Current

-350

+350

mA

Pulsed at 1ms 10% duty cycle

362

mW

Derate at 4.5mW/ºC above +70ºC

Electro-Static Discharge

2500

V

HBM Mil-Std883E 3015.7 methods

Latch Up Immunity IN1, IN2

150

mA

Norm: JEDEC 17

Latch Up Immunity all other Pins

250

mA

Operating Temperature Range

-40

+85

ºC

Junction Temperature

+150

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”