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AS2533F 数据表(PDF) 21 Page - ams AG |
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AS2533F 数据表(HTML) 21 Page - ams AG |
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21 / 25 page ![]() Data Sheet AS2533-36 austriamicrosystems Sizes and Coordinates Die Size: 3.190mm x 2.975mm Bond Pad Size: 85µm x 85µm Bond Pad Co-ordinates: Reference co-ordinate of DIE = DIE center Reference co-ordinate of PAD = PAD center X [µm] y [µm] Pad Name Pin No x [µm] y [µm] Pad Name Pin No Pads on the Left Pads on the Right -1413.50 1052.25 VDD 4 1392.50 -1053.80 R1 20 -1413.50 796.25 AGND 5 1392.50 -663.00 FCI 21 -1413.50 586.25 STB 6 1392.50 -319.80 LED 22 -1413.50 226.25 CI 7 1413.50 408.75 M1 23 -1392.50 -107.75 MO 8 1413.50 683.75 M2 24 -1392.50 -399.35 LLC 9 Pads on the Top -1392.50 -974.20 HS/DP 10 1227.50 1301.25 CS 25 Pads on the Bottom 1079.50 1301.25 VSS 26 -1244.00 -1285.00 OSC 11 969.50 1301.25 VSS 26 -862.10 -1285.00 BOND_AS2535 627.50 1301.25 LI 27 -696.70 -1285.00 MODE 12 54.50 1301.25 RI 28 -432.50 -1285.00 BOND_AS2536 -90.50 1301.25 LS 1 -215.10 -1285.00 C4 13 -449.50 1301.25 MFL 2 -49.70 -1285.00 C3 14 -744.50 1301.25 RO 3 214.50 -1285.00 C2 15 379.90 -1285.00 C1 16 677.30 -1285.00 R4 17 842.70 -1285.00 R3 18 1173.30 -1285.00 R2 19 Revision 8.8 Page 21 of 25 |
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