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AS2702 数据表(PDF) 3 Page - ams AG |
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AS2702 数据表(HTML) 3 Page - ams AG |
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3 / 13 page ![]() AS2702 – AS-Interface Slave IC Revision 1.3, 21-Aug-08 Page 3 of 13 SOIC 20 SOIC 16 Name Type Note Description 14 12 PFAULT I, digital, pull-up 1 Low-active input to flag failure of the sensors/actuators circuitry connected 15 13 LED2 I/O, digital, pull-up 1 LED output 2 (IC test input) 16 14 PSTBn I/O, digital, pull-up 1 Parameter port strobe output (IC test input) 17 15 D3 I/O, digital Bidir. data port bit 3 18 16 D2 I/O, digital Bidir. data port bit 2 19 - P3 I/O, digital, pull-up 1, 2 Bidir. parameter port bit 3 20 - P2 I/O, digital, pull-up 1, 2 Bidir. parameter port bit 2 Notes: 1 The pull-up structure is a passive high-side current source with a nom. 10µA current. 2 The passive pull-up current source as per note 1 on these parameter port pins is off, if the slave device is programmed with I/O-configuration code 7 and a master data call is present. Functional, Electrical and Timing Characteristics All voltages are referenced to ground pin LTGN. Timing is valid for a quartz crystal frequency of 5.333MHz. Absolute Maximum Ratings Symbol Parameter Min Max Unit Note VLTGP Voltage at the positive supply pin -0.3 40 V 1) VCDC Voltage at pin for ext. buffer capacitor -0.3 VLTGP + 0.3V V VU5R Voltage at pins U5R, OSC1, OSC2 -0.3 7 V IIN Input current at any pin, except for LTGP, CDC -50 50 mA 2) ESD1 Electrostatic discharge voltage 1500 V 3) ESD2 Electrostatic discharge voltage 300 V 4) Tstg Storage temperature -55 125 V Tbody Soldering conditions 260 °C 5) Ptot Max. power dissipation 1 W 6) RTHJA Thermal resistance SOIC 16 61.2 74.8 °K/W 7) RTHJA Thermal resistance SOIC 20 58.5 71.5 °K/W 7) Notes: 1) 50V during t > 50µs; repetition rate < 0.5Hz 2) Latch-up immunity test. Please observe max. power dissipation allowed 3) Human body model: R = 1.5kOhm; C = 100pF 4) Machine model; applies only for LTGP 5) The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020C. 6) Free convection, see Figure 2 7) No forced cooling. PCB-surface: 21 cm2; still air volume around the device. 10 cm3 |
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