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AS7620

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

-0.3

40

V

LX

-0.3

V

FB, SHDN

-0.3

or 5.5

V

Whichever is lower

All other pins except LX, FB and SHDN

-0.3

3.6

V

Latch-Up

-30

+30

mA

Norm: JEDEC 78

1

1. Voltage on pin 7 (SHDN) limited to +5.5V

Package Power Dissipation

1

W

θJA = 32ºC/W for a 4-layer board, 4 vias,

Operating Temperature Range

-40

+125

ºC

Junction temperature

Electrostatic Discharge

-1000

+1000

V

Norm: HBM MIL-Std. 883E 3015.7 methods

Humidity (Non-Condensing)

5

90

%R.H.

Storage Temperature

-55

125

ºC

Junction Temperature

150

ºC

Package body temperature

260

ºC

Norm: IPC/JEDEC J-STD-020D.

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.