CYStech Electronics Corp.

Spec. No. : C338AS

Issued Date : 2004.03.10

Revised Date :

Page No. : 3/3

CSMASS1XAS

CYStek Product Specification

SMA-1 Dimension

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.055

0.062

1.40

1.60

E

0.030

0.060

0.76

1.52

B

0.098

0.114

2.50

2.90

F

0.002

0.008

0.051

0.203

C

0.157

0.181

4.00

4.60

G

0.188

0.208

4.80

5.28

D

0.078

0.096

2.00

2.44

H

0.006

0.012

0.152

0.305

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

A

B

C

H

E

G

D

F

2-Lead SMA-1 Plastic

Surface Mounted Package

CYStek Package Code: AS

Marking :

Device CSMA

SS12

CSMA

SS13

CSMA

SS14

CSMA

SS15

Code

SS12

SS13

SS14

SS15

Device CSMA

SS16

CSMA

SS18

CSMA

SS1B

Code

SS16

SS18

SS1B