IP4064CX8_IP4364CX8_IP4366CX8_2

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 02 — 11 February 2010

2 of 14

NXP Semiconductors

IP4064CX8; IP4364CX8; IP4366CX8

Integrated SIM card passive filter array with ESD protection

2.

Pinning information

2.1 Pinning

2.2 Pin description

3.

Ordering information

Fig 1.

Pin configuration

008aaa206

transparent top view,

solder balls facing down

A

23

1

B

C

bump A1

index area

Table 1.

Pinning

Pin

Description

A1

not connected (missing ball)

A2

external pin 1

A3

internal pin 1

B1

external pin 2

B2

ground

B3

internal pin 2

C1

external pin 3

C2

supply ESD protection

C3

internal pin 3

Table 2.

Ordering information

Type number

Package

Name

Description

Version

IP4064CX8/LF/P

WLCSP8

wafer level chip-size package; 8 bumps; 1.41

× 1.41 × 0.65 mm

IP4064CX8/LF/P

IP4364CX8/LF/P

WLCSP8

wafer level chip-size package; 8 bumps; 1.16

× 1.16 × 0.61 mm

IP4364CX8/LF/P

IP4366CX8/P

WLCSP8

wafer level chip-size package; 8 bumps; 1.16

× 1.16 × 0.61 mm

IP4366CX8/P