2/4

●Electrical characteristics (Unless otherwise noted Ta=25℃, Vcc=5.0V)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Conditions

Circuit current

ICC

―

15.0

20.0

mA

―

Maximum

output level

BA7626F/FS

Vom

2.3

2.5

―

Vp-p

f=1kHz, THD=0.5%

Voltage gain

5.7

6.2

6.7

dB

Interchannel crosstalk

―

-65

-45

dB

Mute level

CTM

―

-35

-25

dB

Frequency characteristic

-3

0

+3

dB

Input inpedance

16

20

24

kΩ

CTL pin switching level

2.2

―

3.3

V

―

※

This product is not designed for protection against radioactive rays.

●Truth table

Input

Output

Input

Output

Input

Output

A

B

E

MONOUT

C

D

E

VOUT1

C

D

E

VOUT2

L

L

※

IN1

L

L

※

－

L

L

※

IN1

H

L

※

IN2

H

L

※

IN2

H

L

※

－

L

H

※

IN3

L

H

※

IN3

L

H

※

IN3

H

H

L

IN4

H

H

L

IN4

H

H

L

IN4

H

H

H

IN5

H

H

H

IN5

H

H

H

IN5

※

Indicates “don’t care”(H or L)

●Block diagram

●Application circuit

Fig.1

Fig.2

●Cautions on use

1) Numbers and data in entries are representative design values and are not guaranteed values of the items.

2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further when

using them. When modifying externally attached component constants before use, determine them so that they have

sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only for static

characteristics but also including transient characteristics.

3) Absolute maximum ratings

If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be

damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you think of a case in

which absolute maximum ratings are exceeded, enforce fuses or other physical safety measures and investigate how not to

apply the conditions under which absolute maximum ratings are exceeded to the LSI.

4) GND potential

Make the GND pin voltage such that it is the lowest voltage even when operating below it. Actually confirm that the voltage

of each pin does not become a lower voltage than the GND pin, including transient phenomena.

5) Thermal design

Perform thermal design in which there are adequate margins by taking into account the allowable power dissipation in

actual states of use.

6) Shorts between pins and misinstallation

When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is

misinstalled and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a foreign

substance coming between pins of the LSI or between a pin and a power supply or a pin and a GND.

7) Operation in strong magnetic fields

Adequately evaluate use in a strong magnetic field, since there is a possibility of malfunction.

IN5

1

IN1

CTL A

IN2

CTL B

GND

GND

IN4

CTL E

CTL D

16

15

14

13

12

11

10

9

2

3

4

5

6

7

8

IN3

CTL C

logic

logic

6dB

6dB

MONOUT

1

IN1

MONOUT

FRONT

75

2.2

μ

GND

IN5

GND

IN4

CTL E

IN3

CTL A

IN2

CTL B

CTL C

16

15

14

13

12

11

10

9

2

3

4

5

6

7

8

CTL D

75

2.2

470

μ

75

2.2

47

μ

103

A933

+ 5.0V

REAR

75

2.2

μ

75

2.2

μ

F / R

CTL

REC

CTL

AUX

75

470

μ

100

BS

LD

MON

CTL

75

75

470

μ

100

TV

VTR

OUT

IN1

VTR

OUT

IN2

100

+

+

+

+

+

+

+

+

+