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LX5552 数据表(PDF) 2 Page - Microsemi Corporation

部件名 LX5552
功能描述  2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SPDT Switch
PDF  3 Pages
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制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation

LX5552 数据表(HTML) 2 Page - Microsemi Corporation

  LX5552 Datasheet HTML 1Page - Microsemi Corporation LX5552 Datasheet HTML 2Page - Microsemi Corporation LX5552 Datasheet HTML 3Page - Microsemi Corporation  
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LX5552
PRODUCTION DATA SHEET
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier, LNA & SPDT Switch
TM
®
Copyright
© 2009
Rev. 1.0, 2009-06-02
PRODUCT HIGHLIG HT
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off (PA).......................................................................5V
(LNA) ...................................................................4V
(Switch) ................................................................5V
Collector Current (PA)................................................................................500mA
Drain Current (LNA) ....................................................................................40mA
Total Power Dissipation.................................................................................... 2W
RF Input Power (With 50 Ohm Load at Output) ......................................+10dBm
Maximum Junction Temperature (Tj max) ................................................ +150°C
Operation Ambient Temperature ...................................................-40°C to +85°C
Storage Temperature....................................................................-65°C to +150°C
RoHS/Pb-Free Peak Package Temp. for Solder Reflow
(40 seconds maximum exposure)................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
THERMAL DATA
LU Plastic MLPQ 16-Pin
THERMAL RESISTANCE
-JUNCTION TO CASE,
θ
JC
9.5 C/W
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
50.0 C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PIN OU T
LU PACKAGE
(“See-Through” View from Top)
RoHS/Pb-Free 100% Matte Tin Lead finish
PACKAGE ORDER INFO
LU
Plastic MLPQ
16 pin 3x3mm
RoHS Compliant /Pb-Free
LX5552LU
Note: Available in Tape & Reel.
Append the letters “TR” to the part number.
(i.e. LX5552LU-TR)
MSC
5552
818A
MSC
5552
840A
MSC
5552
818A
MSC
5552
840A
Vcc
1
2
3
9
12
11
10
4
56
7
8
13
14
15
16
Vref
Det
RxOut
Vc2
PAOut
SwIn
NC
Vdd CtrlRx Ant CtrlTx
TxIn
Vc1 NC
NC
GND
Vcc
1
2
3
9
12
11
10
4
56
7
8
13
14
15
16
Vref
Det
RxOut
Vc2
PAOut
SwIn
NC
Vdd CtrlRx Ant CtrlTx
TxIn
Vc1 NC
NC
GND



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