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SS8018

VCC to GND………….….………………………………………………..……….-0.3V to +6V

DXP to GND……….……………………………………………………..……..…-0.3V to VCC + 0.3V

DXN to GND………………………………………………….……..……………..-0.3V to +0.8V

SMBCLK, SMBDATA, ALERT to GND……………………………………...…-0.3V to +6V

SMBDATA, ALERT Current………………………………………………..…….-1mA to +50mA

DXN Current………………………………………………..…..………………….±1mA

ESD Protection (SMBCLK, SMBDATA, ALERT , human body model).…….2000V

ESD Protection (other pins, human body model)……………………………….2000V

(derate 8.30mW/°C above +70°C)………………………………………….......667mW

Operating Temperature Range…………………………………………………-20°C to +120°C

Junction Temperature………………………………………………….………..+150°C

Storage temperature Range…………………………………………………….-65°C to +165°C

Lead Temperature (soldering, 10sec)……………………………………..……...+300°C

PARAMETER

CONDITIONS

MIN TYP MAX UNITS

-1

+1

Temperature Error, Remote Di-

ode (Note 1)

-3

+3

°C

-3

+3

Temperature Error, Local Diode

-5

+5

°C

Supply-Voltage Range

3.0

5.5

V

Undervoltage Lockout Threshold VCC input, disables A/D conversion, rising edge

2.8

V

Undervoltage Lockout Hysteresis

50

mV

Power-On Reset Threshold

VCC, falling edge

1.7

V

POR Threshold Hysteresis

50

mV

SMBus static

3

Standby Supply Current

Logic inputs forced to VCC or GND

Hardware or software

standby, SMBCLK at 10kHz

4

µA

0.5 conv/sec

35

Average Operating Supply

Current

Auto-convert mode. Logic inputs

forced to VCC or GND

8.0 conv/sec

320

µA

Conversion Time

From stop bit to conversion complete (both channels)

125

ms

Conversion Rate Timing

Conversion-Rate Control Byte=04h, 1Hz

1

sec

High level

176

Remote-Diode Source Current

DXP forced to 1.5V

Low level

11

µA

Rev.2.01 6/06/2003