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SS8044 数据表(PDF) 2 Page - Silicon Standard Corp. |
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SS8044 数据表(HTML) 2 Page - Silicon Standard Corp. |
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2 / 5 page ![]() SS8044 12/31/2006 Rev. 1.01 www.SiliconStandard.com 2 MAXIMUM RATINGS (TA=25℃ unless otherwise specified) Input Voltage………………………………..…….…….7V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature…………………150°C Storage Temperature Range..……-65°C T J +150°C Reflow Temperature (soldering, 10sec)............260°C Thermal Resistance Junction to Ambient, (θJA) SOT-223………………………….…………..…147°C/W Thermal Resistance Junction to Case, (θJc) SOT-223……………………………….…………27°C/W OPERATING CONDITIONS Input Voltage………….…….…..……..….……4V ~ 6.5V Temperature Range…………………..-40°C T A 85°C ELECTRICAL CHARACTERISTICS VIN =5V, IO = 600mA, CIN=10µF, COUT =10µF. All specifications apply for TA = TJ = 25°C.[Note 3] PARAMETER CONDITION MIN TYP MAX UNIT Output Voltage 10mA < IO <600mA 3.234 3.3 3.366 V Line Regulation 4V < VIN < 6V, IO = 10mA --- 15 --- mV 10mA < IO < 600mA --- 20 --- Load Regulation 10mA < IO < 250mA --- 10 --- mV Quiescent Current VIN = 5V --- 0.3 --- mA Ripple Rejection fi = 120 Hz, 1VP-P, Io = 100mA --- 47 --- dB IO = 600mA --- 0.65 --- Dropout Voltage IO = 250mA --- 0.25 --- V Output Current --- 600 --- mA Short Circuit --- 0.65 --- A Current Limit 0.8 A Over Temperature --- 145 --- °C NOTE: 1. Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. 2. The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / JA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC go into thermal shutdown. The JA of SOT-223 package is 147°C/W (See Recommended Minimum Footprint). 3. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 4. The type of output capacitor should be tantalum or aluminum. |
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