SS8046 datasheet(3/7 Pages) SSC

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Rev.2.01 6/06/2003

SS8046

Electrical Characteristics

VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =47µF, TA = TJ = 25°C unless otherwise specified [Note 3]

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Output Voltage

IO =0.5A

3.22

3.3

3.38

Line Regulation

4V < VIN < 7V, IO = 10mA

0.5

Load Regulation

50mA < IO < 2A

0.5

Quiescent Current

VIN = 5V

Ripple Rejection

fi = 120Hz, 1VP-P, IO = 100mA

Dropout Voltage

IO = 2A

0.5

Short Circuit Current

3.8

Over Temperature

150

°C

Disable Voltage High

VdisH

Output Active

2.0

Disable Voltage Low

VdisL

Output Disabled

0.8

Disable Bias Current High

IdisH

Vdis = 2.7V

µA

Disable Bias Current Low

IdisL

Vdis = 0.4V

µA

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Con-

ditions are conditions under which the device functions but the specifications might not be guaranteed.

For guaranteed specifications and test conditions see the Electrical Characteristics.

Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal

resistance,

JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient

temperature is Tjmax-TA /

JA. If this dissipation is exceeded, the die temperature will rise above 150°C

and the device will go into thermal shutdown. For the TO 220 package,

JA is 60°C/W (No heat sink).

Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient

as possible.

Note4: The output capacitor should be a tantalum or aluminum type.

Definitions

Dropout Voltage

The input/output voltage differential at which the regu-

lator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 2% below its nominal value, dropout volt-

age is affected by junction temperature, load current

and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input

voltage. The measurement is made under conditions

of low dissipation or by using pulse techniques such

that average chip temperature is not significantly af-

fected.

Load Regulation

The change in output voltage for a change in load cur-

rent at constant chip temperature. The measurement

is made under conditions of low dissipation or by us-

ing pulse techniques such that average chip tempera-

ture is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.

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