Preliminary Technical Data

ADMP404

Rev. PrH | Page 9 of 12

HANDLING INSTRUCTIONS

PICK AND PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick-

and-place and chip shooting equipment. Care should be taken

to avoid damage to the MEMS microphone structure as follows:

•

Use a standard pickup tool to handle the microphone.

Because the microphone hole is on the bottom of the

package, the pickup tool can make contact with any part

of the lid surface.

•

Use care during pick-and-place to ensure that no high

shock events above 20 kg are experienced because such

events may cause damage to the microphone.

•

Do not pick up the microphone with a vacuum tool that

makes contact with the bottom side of the microphone.

Do not pull air out of or blow air into the microphone port.

•

Do not use excessive force to place the microphone on

the PCB.

REFLOW SOLDER

For best results, the soldering profile should be in accordance

with the recommendations of the manufacturer of the solder

paste used to attach the MEMS microphone to the PCB. It is

recommended that the solder reflow profile not exceed the limit

conditions specified in Figure 2 and Table 3.

BOARD WASH

When washing the PCB, ensure that water does not make

contact with the microphone port. Blow-off procedures and

ultrasonic cleaning must not be used.