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GLZ3.0 数据表(PDF) 1 Page - Diotech Company. |
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GLZ3.0 数据表(HTML) 1 Page - Diotech Company. |
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1 / 4 page ![]() GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES MECHANICAL DATA ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ ) Symbols Value Units Zener current see table "Characteristics" Power dissipation at TA=25℃ Ptot mW Junction temperature TJ Storage temperature range TSTG 1)Valid provided that at a distance of 8mm from case are kept at ambient temperature ELECTRICAL CHARACTERISTICS(TA=25℃ ) Symbols Min. Typ. Max. Units Thermal resistance junction to ambient RTHA 0.31) K/mW Forward voltage at IF=100mA VF 1 V 1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature 5001) 175 -65 to + 175 ℃ ℃ Dimensions in inches and (millimeters) 0.146(3.7) 0.130(3.3) 0.063(1.6) 0.055(1.4) 0.020(0.5) 0.012(0.3) 0.020(0.5) 0.012(0.3) MINI-MELF / LL-34 DIA. • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Polarity: See Diagram Below • Approx. Weight: 0.03 grams • Mounting Position: Any • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above |
类似零件编号 - GLZ3.0 |
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类似说明 - GLZ3.0 |
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