74LVC2G241_9

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 09 — 10 June 2008

2 of 18

NXP Semiconductors

74LVC2G241

Dual buffer/line driver; 3-state

3.

Ordering information

4.

Marking

5.

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVC2G241DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74LVC2G241DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package; 8 leads;

body width 2.3 mm

SOT765-1

74LVC2G241GT

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package; no leads;

8 terminals; body 1

× 1.95 × 0.5 mm

SOT833-1

74LVC2G241GD

−40 °C to +125 °C

XSON8U

plastic extremely thin small outline package; no leads;

8 terminals; UTLP based; body 3

× 2 × 0.5 mm

SOT996-2

74LVC2G241GM

−40 °C to +125 °C

XQFN8U

plastic extremely thin quad flat package; no leads;

8 terminals; UTLP based; body 1.6

× 1.6 × 0.5 mm

SOT902-1

Table 2.

Marking codes

Type number

Marking code

74LVC2G241DP

V241

74LVC2G241DC

V41

74LVC2G241GT

V41

74LVC2G241GD

V41

74LVC2G241GM

V41

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

001aah844

1OE

1Y

1A

2OE

2Y

2A

001aah845

EN1

EN2

1

2