74LVC3G07_6

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 06 — 16 June 2008

2 of 16

NXP Semiconductors

74LVC3G07

Triple buffer with open-drain output

3.

Ordering information

4.

Marking

5.

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVC3G07DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads; body

width 3 mm; lead length 0.5 mm

SOT505-2

74LVC3G07DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package; 8 leads;

body width 2.3 mm

SOT765-1

74LVC3G07GT

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package; no leads; 8

terminals; body 1

× 1.95 × 0.5 mm

SOT833-1

74LVC3G07GD

−40 °C to +125 °C

XSON8U

plastic extremely thin small outline package; no leads;

8 terminals; UTLP based; body 3

× 2 × 0.5 mm

SOT996-2

74LVC3G07GM

−40 °C to +125 °C

XQFN8U

plastic extremely thin quad flat package; no leads; 8

terminals; UTLP based; body 1.6

× 1.6 × 0.5 mm

SOT902-1

Table 2.

Marking codes

Type number

Marking code

74LVC3G07DP

V07

74LVC3G07DC

V07

74LVC3G07GT

V07

74LVC3G07GD

V07

74LVC3G07GM

V07

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

Fig 3.

Logic diagram (one driver)

001aah762

3A

3Y

2A

2Y

1A

1Y

001aah763

3Y

3A

2Y

2A

1Y

1A

1

1

1

mna591

Y

A

GND