OUT

8 W

13 W

Output

IN

Input

1MW

500 W

EN

Enable

500 W

1MW

ISO7230C, ISO7230M

ISO7231C, ISO7231M

SLLS867H – SEPTEMBER 2007 – REVISED DECEMBER 2009

www.ti.com

DEVICE INFORMATION

PACKAGE CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (Clearance)

Shortest terminal-to-terminal distance through air

8.34

mm

Shortest terminal-to-terminal distance across the

L(I02)

Minimum external tracking (Creepage)

8.1

mm

package surface

Minimum Internal Gap (Internal

Distance through the insulation

0.008

mm

Clearance)

barrier tied together creating a two-terminal device,

Ω

Isolation resistance

Ω

Barrier capacitance Input to output

2

pF

Input capacitance to ground

2

pF

REGULATORY INFORMATION

VDE

CSA

UL

Recognized under 1577

Certified according to IEC

Approved under CSA Component

Component Recognition

60747-5-2

Acceptance Notice

File Number: 40016131

File Number: 1698195

File Number: E181974

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL 1577.

DEVICE I/O SCHEMATICS

THERMAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

Junction-to-Board Thermal Resistance

61

°C/W

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

14

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Product Folder Link(s): ISO7230C, ISO7230M ISO7231C, ISO7231M