TPS735xx

SBVS087H – JUNE 2008 – REVISED NOVEMBER 2009

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

(2)

TPS735xx yyy z

XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).

YYY is package designator.

Z is package quantity.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Output voltages from 1.0V to 3.6V in 50mV increments are available through the use of innovative factory EEPROM programming;

minimum order quantities may apply. Contact factory for details and availability.

ABSOLUTE MAXIMUM RATINGS

Over operating temperature range (unless otherwise noted).

(1)

PARAMETER

TPS735xx

UNIT

–0.3 to +7.0

V

V

V

V

Peak output current

Internally limited

Continuous total power dissipation

See Dissipation Ratings Table

–55 to +150

°C

–55 to +150

°C

ESD rating, HBM

2

kV

ESD rating, CDM

500

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

DISSIPATION RATINGS

DERATING FACTOR

BOARD

PACKAGE

DRV

20°C/W

140°C/W

7.1mW/°C

715mW

395mW

285mW

DRV

20°C/W

65°C/W

15.4mW/°C

1.54W

845mW

615mW

DRB

1.2°C/W

40°C/W

25mW/°C

2.5W

1.38W

1.0W

(1)

The JEDEC low-K (1s) board used to derive this data was a 3in × 3in (7,62cm × 7,62cm), two-layer board with 2-ounce (56,699g)

copper traces on top of the board.

(2)

The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in (7,62cm × 7,62cm), multilayer board with 1-ounce (28,35g)

internal power and ground planes and 2-ounce (56,699g) copper traces on top and bottom of the board.

(3)

2

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