144

15

RoHS Compliant, ELV Compliant

Solder Reflow

• Recommended reflow methods:

- IR

- Hot air

- Nitrogen

• Recommended maximum paste thickness: 0.25mm (0.010 inch)

• Devices can be cleaned using standard methods and aqueous solvents.

• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed

underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.

• Customer should validate that the solder paste amount and reflow recommendations meet its application.

• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch

devices. It is possible that raised features could negatively impact solderability performance of our devices.

Rework

• picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices. Please also avoid direct contact to the device.

• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.

Solder Reflow and Rework Recommendation for Surface-mount Devices

Critical Zone

T

Ramp up

t 25˚C to Peak

Reflow Profile

Time

Ramp down

ts

Preheat

Ts

MAX

T

L

Tp

tp

25

Ts

MIN

t

L

Figure S15

Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

3°C/second max.

3°C/second max.

Preheat

100°C

150°C

150°C

200°C

60-120 seconds

60-180 seconds

Time maintained above:

183°C

217°C

30-70 seconds

30-70 seconds

Peak/Classification temperature (Tp)

240°C

260°C

Time within 5°C of actual peak temperature

Time (tp)

10-30 seconds

20-40 seconds

Ramp down rate

6°C/second max.

6°C/second max.

Time 25°C to peak temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.