PCF8564ACX9SLASH1 datasheet(41/44 Pages) NXP

41 / 44 page

PCF8564A_1

Product data sheet

Rev. 1 — 8 October 2009

41 of 44

NXP Semiconductors

PCF8564A

Real time clock and calendar

20. Abbreviations

21. References

[1]

AN10365 — Surface mount reﬂow soldering description

[2]

AN10706 — Handling bare die

[3]

IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[4]

IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[5]

IPC/JEDEC J-STD-020 — Moisture/Reﬂow Sensitivity Classiﬁcation for

Nonhermetic Solid State Surface Mount Devices

[6]

JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[7]

JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[8]

JESD78 — IC Latch-Up Test

[9]

JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[10] SNW-SQ-623 — NXP store and transport conditions

[11] UM10204 — I2C-bus speciﬁcation and user manual

Table 36.

Abbreviations

Acronym

Description

BCD

Binary Coded Decimal

CMOS

Complementary Metal Oxide Semiconductor

FFC

Film Frame Carrier

HBM

Human Body Model

I2C

Inter-Integrated Circuit

Integrated Circuit

LSB

Least Signiﬁcant Bit

Machine Model

MOS

Metal Oxide Semiconductor

MSB

Most Signiﬁcant Bit

MSL

Moisture Sensitivity Level

PCB

Printed-Circuit Board

POR

Power-On Reset

ROM

Read Only Memory

RTC

Real Time Clock

SCL

Serial Clock Line

SDA

Serial Data Line

SRAM

Static Random Access Memory

WLCSP

Wafer Level Chip-Size Package

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