104

RoHS Compliant, ELV Compliant

HF Halogen Free

10

Fault Current (A)

100

10

1

0.1

0.01

0.001

10

0.1

1

100

A

A

B

C

D

E

BCDE

Figure S15

SMD2xxxF

A=

SMD150F, SMD150F/33

B=

SMDH160

C=

SMD185F

D=

SMD200F

E=

SMD250F

Fault Current (A)

100

10

1

0.1

0.01

0.001

0.1

1

10

100

B

B

A

A

C

C

D

D

E

E

F

G

H

FG

H

Figure S14

SMDxxxF

A=

SMD030F

B=

SMD050F

C=

SMD075F, SMD075F/60

D=

SMDH120

E=

SMD100F, SMD100F/33

F=

SMD125F

G=

SMD260F

H=

SMD300F, SMD300F/15

Physical Characteristics

Terminal pad material

100% matte tin with nickel underplate

Soldering characteristics

ANSI/J-STD-002 Category 3 for femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series

ANSI/J-STD-002 Category 1 for SMD series

Solder heat withstand

per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A

Flammability resistance

per IEC 695-2-2 Needle Flame Test for 20 sec.

Recommended storage conditions 40°C max, 70% R.H. max; devices may not meet specified ratings if storage conditions are exceeded.

Environmental Specifications

Test

Test Method

Conditions

Resistance Change

Storage life

Raychem PS300, Section 5.3.2

60°C, 1000 hours

±3% typical

85°C, 1000 hours

±5% typical

Humidity aging

Raychem PS300, Section 5.3.1

85°C, 85% RH, 100 hours

±1.2% typical

Thermal shock

MIL-STD-202, Method 107G

85°C, -40°C (20 times)

-33% typical

125°C, -55°C (10 times)

-33% typical

Vibration

MIL-STD-883C

per MIL-STD-883C

No change

Solvent resistance

Raychem PS300, Section 5.2.2

Freon

No change

Trichloroethane

No change

Hydrocarbons

No change

Figure S5-S15 Typical Time-to-trip Curves at 20°C for Surface-mount Devices

Cont’d

Table S5

Physical Characteristics and Environmental Specifications for Surface-mount Devices

Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH120 and SMDH160