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数据搜索系统，热门电子元器件搜索 |
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LVR040K 数据表(PDF) 16 Page - Tyco Electronics |
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LVR040K 数据表(HTML) 16 Page - Tyco Electronics |
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16 / 27 page  Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices LVR/LVRL Physical Characteristics Lead material LVR005-016: Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.) LVR025-040: Tin-plated copper, 0.32mm2 (22AWG), ø0.64mm (0.025in.) LVR055: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.) LVRL: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.) Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3 Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C Devices are not designed to be placed through a reflow process. LVR/LVRL Environmental Specifications Test Conditions Resistance Change Passive aging 70°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85%RH, 1000 hours ±5% Thermal Shock 85°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change BBRF Physical Characteristics Lead material Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.) Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3 Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method 1a, condition b, can withstand 10 seconds at 260°C ±5°C Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0 Devices are not designed to be placed through a reflow process. BBRF Environmental Specifications Test Conditions Resistance Change Passive aging 70°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85%RH, 1000 hours ±5% Thermal Shock 85°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change RXEF Physical Characteristics Lead material RXEF005: Tin-plated nickel-copper ally, 0.128mm2 (26AWG), ø0.40mm (0.016in.) RXEF010: Tin-plated nickel-copper ally, 0.205mm2 (24AWG), ø0.51mm (0.020in.) RXEF017 to 040: Tin-plated copper-clad steel, 0.205mm2 (24AWG), ø0.51mm (0.020in.) RXEF050 to 090: Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.) RXEF110 to 375: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.) Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3 RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1 Solder heat withstand RXEF017- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 5 seconds at 260°C ±5°C Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0 Devices are not designed to be placed through a reflow process. RXEF Environmental Specifications Test Conditions Resistance Change Passive aging -40°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85%RH, 1000 hours ±10% Thermal Shock 85°C, -40°C (10 times) ±10% Solvent resistance MIL-STD-202, Method 215F No change 125 13 |
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