ADA4051-1/ADA4051-2

Rev. B | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

Input Current1

±10 mA

Differential Input Voltage2

Output Short-Circuit Duration to GND

Indefinite

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

soldered on a circuit board for surface-mount packages with its

exposed paddle soldered to a pad, if applicable. Table 5 shows

simulated thermal values for a 4-layer (2S2P) JEDEC standard

thermal test board, unless otherwise specified.

Table 5. Thermal Resistance

Package Type

Unit

5-Lead SOT-23 (RJ-5)

190

92

°C/W

5-Lead SC-70 (KS-5)

534

173

°C/W

8-Lead MSOP (RM-8)

142

45

°C/W

8-Lead LFCSP (CP-8-2)

77

14

°C/W

current to 10 mA or less whenever input signals exceed the power supply

rail by 0.3 V.

POWER SEQUENCING

1.33 kΩ resistors and back-to-back diode-connected N-MOSFETs (with a

The op amp supplies must be established simultaneously with

or before any input signals are applied. If this is not possible, the

input current must be limited to 10 mA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION