MP3V5004G

Sensors

Freescale Semiconductor

5

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale Semiconductor designates the two sides of the

pressure sensor as the Pressure (P1) side and the Vacuum

(P2) side. The Pressure (P1) side is the side containing

silicone gel which isolates the die from the environment. The

Freescale Semiconductor pressure sensor is designed to

operate with positive differential pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below.

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

Figure 5. SOP Footprint

Part Number

Case Type

Pressure (P1) Side Identifier

MP3V5004GC6U/T1

482A

Side with Port Attached

MP3V5004GP

1369

Side with Port Attached

MP3V5004DP

1351

Side with Part Marking

MP3V5004GVP

1368

Stainless Steel Cap

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1