YEV09T10 10A DC-DC POL Converter

Data Sheet

ZD-02092 Rev 1.1, 25-Mar-09

www.power-one.com

Page 1 of 12

Member of the

Family

Applications



Low voltage, high density systems with

Intermediate Bus Architectures (IBA)



Point-of-load regulators for high performance

DSP, FPGA, ASIC, and microprocessors



Desktops, servers, and portable computing



Broadband, networking, optical, and

communications systems

Benefits



One part that covers many applications



Reduces board space, system cost and

complexity, and time to market

Features



RoHS lead free and lead-solder-exempt products are

available



Wide operating temperature range: 0 to 70 ºC;

optional to a range of -40 to 85 ºC



High efficiency synchronous buck topology



Low noise fixed frequency operation



Wide input voltage range: 4.5V–13.8V



High continuous output current: 10A



Programmable output voltage range: 0.59V–5.1V



Overcurrent, and output overvoltage protections with

automatic restart



Enable input



Start up into prebiased load



No minimum load requirements



High MTBF of 67 million hours



Industry standard size through-hole single-in-line

package and pinout



0.41”x0.40” (10.4mm x 10.16mm)



Low height of 0.65” (16.51mm)



UL94 V-0 flammability rating



UL60950, CSA C22.2 No. 60950-00, and TUV

EN60950-1:2001

Description

The YEV09T10, non-isolated DC-DC point of load (POL) converter, delivers up to 10A of output current in an

industry-standard single-in-line (SIP) through-hole package. The YEV09T10 POL converter is an ideal choice for

Intermediate Bus Architectures where point of load conversion is a requirement. Operating from a 4.5-13.8V input

the POL converter provides an extremely tightly regulated programmable output voltage of 0.59V to 5.1V. The

POL converter offers exceptional thermal performance, even in high temperature environments with minimal

airflow.

This performance is accomplished through the use of advanced circuit solutions, packaging and

processing techniques. The resulting design possesses ultra-high efficiency, excellent thermal management, and

a slim body profile that minimizes impedance to system airflow, thus enhancing cooling for both upstream and

downstream devices. The use of automation for assembly, coupled with advanced power electronics and thermal

design, results in a product with extremely high reliability.