ADP172

Rev. B | Page 16 of 20

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP172. However, as can be seen from Table 6, a point of

diminishing returns is eventually reached, beyond which an

increase in the copper size does not yield significant heat

dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0402 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution for

boards on which area is limited.

Figure 37. Example ADP172 PCB Layout