11

ST Series

BRecommended Temperature Profile (Lead-free soldering compound)

(ç)

250

200

150

100

60S

30S

50

HRS test conditions

Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu

Test board: Glass epoxy 35mm∞35mm∞0.8mm thick

The temperature profiles are based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.