RB751_SER_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 21 May 2007

6 of 10

NXP Semiconductors

RB751 series

Schottky barrier single diodes

10. Soldering

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 7.

Reflow soldering footprint SOD882

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 8.

Reflow soldering footprint SOD523 (SC-79)

mbl872

1.30

0.30

R = 0.05 (8

×)

R = 0.05 (8

×)

0.60

(2

×)

0.70

(2

×)

0.80

(2

×)

0.90

0.30

(2

×)

0.40

(2

×)

0.50

(2

×)

solder lands

solder resist

occupied area

solder paste

mgs343

1.80

1.90

0.30

0.40

0.50

1.20

0.60

2.15

solder lands

solder resist

occupied area

solder paste