SA56004GD datasheet(33/36 Pages) NXP

33 / 36 page

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

33 of 36

NXP Semiconductors

SA56004X

Digital temperature sensor with overtemperature alarms

2. Route the D+ and D

− lines parallel and close together with ground guards enclosing

them (see Figure 25).

3. Leakage currents due to printed-circuit board contamination must be considered.

Error can be introduced by these leakage currents.

4. Use wide traces to reduce inductance and noise pick-up. Narrow traces more readily

pick up noise. The minimum width of 10 mil and space of 10 mil are recommended.

5. Place a bypass capacitor of 10 nF close to the VDD pin and an input ﬁlter capacitor of

2200 pF close to the D+ and D

− pins.

6. A shielded twisted pair is recommended if remote sensor is located several feet away

from the temperature sensor. Under this circumstance, connect the shield of the cable

at the device side to the SA56004X GND pin and leave the shield at the remote end

unconnected to avoid ground loop currents. Also notice that the series resistance of

the cable may introduce measurement error; 1

Ω can introduce about 0.5 °C.

16. Abbreviations

Fig 25. D+ and D

− trace layout

002aad227

GND

D+

−

Table 22.

Abbreviations

Acronym

Description

A/D

Analog-to-Digital

ARA

Alert Response Address

ASIC

Application Speciﬁc Integrated Circuit

CRT

Cathode Ray Tube

ESD

ElectroStatic Discharge

HBM

Human Body Model

HVAC

Heating, Ventilating and Air Conditioning

I2C-bus

Inter-Integrated Circuit bus

LSB

Least Signiﬁcant Bit

Machine Model

MSB

Most Signiﬁcant Bit

OTP

One-Time Programmable

POR

Power-On Reset

PTAT

Proportional To Absolute Temperature

SMBus

System Management Bus

UVL

Under Voltage Lockout

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